Contamination Troubleshooting for Microelectronics Packaging

High Reliability Plastic Packaging for Microelectronics

This Laboratory Directed Research & Development (LDRD) project conducted in fiscal years 1996 and 1997 under case 3526.030 was devoted to the development of test structures and associated measurement methodology for assessing the reliability of plastic encapsulated microelectronic devices. The end goal was the conceptual specification of one or more Assembly Test Chips (ATCs) which could be use...

European Microelectronics and Packaging Symposium

An advanced substrate level patterning technique is presented to realize 3D interconnection circuitry on electronic modules. The technique is based on diffraction of light by phase gratings. The phase gratings are incorporated into the photomask at discrete locations. By illuminating the photomask at normal incidence, the phase grating causes locally inclined UV exposure, which is used to expos...

Design Guidelines for Anisotropic Conductive Adhesive Assemblies in Microelectronics Packaging

Multiple parameters are involved in the design of anisotropic conductive adhesive assemblies, and the overlapping influences that they have on the final electrical contact resistance represent a difficult challenge for the designers. The most important parameters include initial bonding force F, number of particles N, the adhesion strength GA, and modulus of elasticity E of the cured resin. It ...

Capillary-driven micro flows for the underfill process in microelectronics packaging

Capillary-driven micro flow allows liquid transport by interfacial force without external pressure or momentum. Theoretical and experimental studies have been conducted to predict the movement of the flow meniscus in the application of capillary underfill flows. In a flip chip package, two-dimensional motions of flow front through solder bumps can result in unwanted air void formation because t...

Fumed-Alumina-Derived Nanoporous Alumina as a New Low-k Dielectric Material for Microelectronics Packaging